10th International Aerosol Conference September 2 - September 7, 2018 America's Center Convention Complex St. Louis, Missouri, USA
Abstract View
Application of Particle and Aerosol Technology to CMP (Chemical Mechanical Planarization) Process Optimization
TAESUNG KIM, Chulmin Shin, Seokjun Hong, Sungkyunkwan University
Abstract Number: 75 Working Group: Instrumentation
Abstract Chemical Mechanical Planarization (CMP) has become one of the most important and enabling semiconductor fabrication processes. Especially for logic devices, the number of CMP steps more than tripled from 28nm to 10/7nm node to enable complex integration schemes. However, there are still many aspects in CMP that have not been explained, which makes CMP rather art than science.
In this presentation, I will describe an effort to apply particle and aerosol technology to CMP process analysis to find a way to explain some of the phenomena more accurately. Firstly, Scanning Mobility Particle Sizer (SMPS), which is one of the standard instruments to measure particle size distribution, will be introduced for the measurement of slurry abrasive size distribution. Secondly, particle transport simulation with Computational Fluid Dynamics (CFD) will be introduced to predict pad debris transport between the wafer and pad, which can explain the pad debris trapping of laser drilled holes on the pad. Finally, new concept of pad debris removal to reduce scratch will be introduced.